SYSTEMS
Fujitsu Selects Intel Media Switch Silicon for Newest Ethernet Switch
- Written by: Writer
- Category: SYSTEMS
SANTA CLARA, CA -- Fujitsu has selected an Intel(R) Media Switch chip as the foundation for its newest broadband metropolitan-area-network (MAN) IP switch. The high level of integrated functionality in the Intel Media Switch device enabled Fujitsu to achieve a significant time-to-market advantage with its new IP switch. Fujitsu is using the Intel(R) Media Switch IXE2424 10/100+Gigabit L2/3/4 Advanced Device in its new GeoStream(1) L3 switch, designed for delivering broadband IP services across metropolitan and enterprise networks. It also uses the Intel Media Switch device in its existing GeoStream Optical Ethernet Access Systems. The IXE2424 device incorporates layer 2-4 switching, quality of service, and security into a single chip, cutting cost and time equipment makers would typically require to develop high-bandwidth voice, video and data applications. "At Fujitsu, we are always aiming at innovation, which means we are continually on very tight timelines to release new products with increasingly rich feature sets," said Atsuhisa Takahashi, general manager of IP Systems Division, Network System Group, Fujitsu Limited. "The high level of integration and easy scalability of the Intel Media Switch IXE2424 device enabled us to cost effectively develop our new products under extremely tight time lines." The IXE2424 device performs wire-speed layer-2/3/4 switching and routing, and is equipped with four gigabit and 24 10/100 Ethernet ports. It supports advanced traffic prioritization, multiprotocol label switching, differentiated services, weighted random early detection, quality of service and bandwidth management capabilities. "Fujitsu's leading-edge development program provides an apt proving ground for Intel's modular building-block approach to designing communications equipment," said Tom Franz, vice president and general manager of Intel's Network Processing Group. "Integration of standards-based features onto a single chip eliminates costly, time-consuming development processes that equipment makers previously endured. The result is new products out the door months quicker than previously possible and at less cost."