APPLICATIONS
GORE SFP+ Assemblies offer cost-effective alternative to fiber optic modules
W. L. Gore & Associates, Inc. has drawn on its expertise in electronic cable design to develop the new GORE SFP+ Copper Cable Assemblies for the high-performance computing (HPC), enterprise networking and network storage markets. These cable assemblies offer a more reliable, lower power and more cost-effective alternative to fiber optic modules for transmitting 10 Gbps data up to 25 meters. GORE SFP+ Copper Cable Assemblies comply with the SFF-8431 standard, while providing reduced jitter, a very low latency, and a maximum signal eye opening. According to Herb Vandeusen, Gore's product specialist for GORE SFP+ Copper Cable Assemblies, "Our SFP+ copper cable assemblies have been proven to be a cost-effective solution to high-performance computing applications, specifically in the 10 Gigabit Ethernet and 8G and 10G fibre channel markets." GORE SFP+ Copper Cable Assemblies provide the highest performance with a lower dielectric constant, lower loss, tighter impedance control, and a wider bandwidth. Through the use of a proprietary expanded PTFE dielectric, Gore achieves a smaller cable size for a given conductor or a larger conductor in a specific twinax diameter. These cables are completely RoHS-compliant, even with some exemptions that have been recently eliminated. The connector is made with a high-performance, low-loss RF material to reduce dielectric loss and provide a higher degree of impedance control through the link as well as reduced crosstalk compared to lossy FR-4 designs.
The GORE SFP+ Copper Cable Assembly is the latest addition to Gore's line of products for high-performance digital interconnects, which includes DDR and QDR Infiniband, CX-4, GbX, AIRMAX VS, and ERmet ZD cable interconnects. These cable assemblies are being adopted by major original equipment manufacturers. For more information about Gore's full line of cables and assemblies, visit its Web site.